Bonding Machine
OMedaSemi cooperate with ISABER (the most expert bonding machine company in China) to provide various bonding machine for clients , we provide surface active room temperature bonding machine ,hydrophilic bonding machine ,fusion bonding machine ,chip to chip bonding machine and chip to wafer bonding machine .also we have served many top company in the world ,
you can see the information below and if you are interested in our products ,we can orangized a meeting toi share more with you.
Adavantage：
*Various bonding technologies: ultra-high vacuum room temperature bonding, hydrophilic bonding, hot pressing/anodic bonding,
*Can achieve room temperature or low temperature bonding of wafers to reduce the impact of thermal stress;
*Multiple alignment methods can achieve sub-micron high-precision alignment;
*Full range of R&D & mass production machines, providing customers with a variety of options;
*Core modules are autonomous and controllable, with strong customization capabilities.
Application：
*Composite substrate manufacturing： SOl, POl, etc.;
*Three-dimensional stacking for CIS, word storage chips, chiplet manufacturing;
*MEMS, fluidic devices, microLED and other advanced manufacturing.
Room temperature bonding machine
SAB6100--Semi-automatic room temperature bonding machine
SAB6110--Fully automatic room temperature bonding machine
SAB6110CST--Fully automatic high-capacity room temperature bonding machine
Hydrophilic Bonding Machine
SAB6210--Fully automatic Hydrophilic Wafer bonding machine
Hot Press Bonding Machine
SAB6300--Semi-automatic hot-press anode wafer bonding machine
Temporary Bonding Machine
SAB6400--Semi-automatic temporary bonding and debonding machine
SAB6410--Fully automatic temporary bonding machine
Chip to Wafer and Chip to Chip Bonding Machine
SAB8210CW--Fully automatic C2W chip bonding machine
SAB8300--semi-automatic C2C bonding machine
SAB8300CW--Semi-automatic C2W chip bonder
Trimming Machine
SAB9510--Fully automatic cluster plasma TRIM machine
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
