The fabrication process of Silicon-on-Insulator (SOI) wafers involves several key steps. SOI wafers are used in various semiconductor applications, including advanced integrated circuits (ICs), RF devices, and MEMS. Here’s an overview of the fabrication process and its applications:
Capbility:
Size:4 inch -8 inch
Tolerance of Device Layer:+-20nm
Advantage:
We have a full process of bonding, ion implantation, annealing, and polishing production lines, so we have strong custom processing capabilities. Unlike the arrogant attitude of the world's mainstream SOI manufacturers, we accept orders of one piece of SOI wafer. At the same time, we have a relatively fast delivery speed. The production process takes 4 weeks and the transportation process takes 1 week.
Stock List
Please click the lick to download the list of SOI wafer Stock
### Fabrication Process of SOI Wafers:
1. **Starting Material Selection:**
- **Substrate Wafer:** The base wafer is typically a standard silicon wafer.
- **Insulator Layer:** The most common insulator used is silicon dioxide (SiO2), though other materials can be used as well.
2. **Bonding Techniques:**
- **Wafer Bonding (SOI):** The silicon wafer is bonded to a layer of silicon dioxide. This is done through processes such as direct bonding or fusion bonding, where two wafers are brought into contact and heat/pressure is applied to form a strong bond.
- **Smart Cut Method:** This is a widely used method for producing SOI wafers, where a thin layer of silicon is implanted with hydrogen ions and then bonded to an oxidized wafer. The bonded assembly is then subjected to heat, causing the implanted layer to cleave, forming a thin silicon layer atop an insulating layer.
3. **Layer Thickness Control:**
- The thickness of the silicon layer and the insulating layer must be precisely controlled. This can be achieved through various techniques, including ion implantation and etching.
4. **Wafer Thinning:**
- If necessary, the SOI wafer may undergo further thinning to achieve the desired dimensions for applications.
5. **Surface Cleaning and Finishing:**
- The wafers are thoroughly cleaned to remove any contaminants. A final polish may also be applied to ensure a smooth surface.
6. **Characterization and Quality Control:**
- The wafers undergo various tests to ensure they meet the required specifications, including electrical and physical characteristics.
### Applications of SOI Wafers:
1. **High-Performance Integrated Circuits (ICs):**
- SOI technology enhances the performance of high-speed and low-power devices, reducing parasitic capacitance and thus improving switching speeds.
2. **Radio Frequency (RF) Devices:**
- SOI wafers are used in RF applications due to their higher electromechanical performance and lower noise figures.
3. **Ultra-Low Power Devices:**
- SOI technology is ideal for low-power applications, such as IoT devices and mobile electronics, as it minimizes leakage currents.
4. **Memory Devices:**
- SOI wafers are employed in manufacturing certain types of memory, including SRAM and Flash memory, to improve performance and reduce power consumption.
5. **Micro-Electro-Mechanical Systems (MEMS):**
- SOI wafers are also used in MEMS fabrication, allowing for the integration of mechanical and electronic components on a single chip.
6. **Solar Cells:**
- Certain types of SOI wafers are investigated for use in solar cells, utilizing their lightweight and efficient characteristics.
By leveraging the properties of SOI wafers, manufacturers can create devices that are faster, more efficient, and capable of meeting the demands of various modern applications.
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
