Basic Principle:
Pulsed Laser Deposition (PLD) is a physical vapor deposition technology widely used for thin film preparation. The following is a detailed introduction to PLD:
1. Laser beam focusing: High-energy pulsed laser (usually UV laser, such as Nd:YAG laser) is focused onto the surface of the target material.
2. Target evaporation: The laser interacts with the target material, causing the target material to heat up, melt and evaporate locally and form a plasma plume.
3. Thin film deposition: Atoms and molecules in the plasma plume are deposited on the substrate to form a thin film.
4. Cooling and crystallization: The material deposited on the substrate cools and crystallizes to form the desired thin film structure.
Processing Capability:
Size: 2 inches
Material: BaTiO3 (barium titanate) SrTiO3 (strontium titanate)
Process Flow:
1. Prepare the target material: Select and prepare the target material for the material to be deposited.
2. Vacuum chamber: Place the target and substrate into the vacuum chamber and evacuate it.
3. Laser settings: Adjust the laser parameters (wavelength, energy, frequency, etc.) to ensure that the laser beam energy is stable.
4. Laser targeting: Focus the laser beam on the surface of the target and perform pulsed laser targeting.
5. Thin film growth: The evaporated material from the target is deposited on the substrate to control the deposition rate and film thickness.
6. Post-processing: If necessary, perform annealing or other post-processing steps to optimize the film performance.
li Materials that can be deposited:
- Metals (such as aluminum, titanium, gold, silver, etc.)
- Semiconductor materials (such as silicon, gallium arsenide, etc.)
- Oxides (such as barium titanate, strontium titanate, etc.)
- High-temperature superconductors (such as YBa2Cu3O7)
- Other functional materials (such as perovskite solar cell materials, ferroelectric materials, etc.)
Application markets:
- Electronic and semiconductor devices: manufacturing integrated circuits, optoelectronic devices, sensors, etc.
- Optical thin films: manufacture anti-reflection films, filters, laser lenses, etc.
- High-temperature superconducting materials: preparation of high-temperature superconducting films for superconducting electronic devices.
- Energy field: manufacture of solar cells, energy storage materials, etc.
- Biomedicine: manufacture of biocompatible materials, drug delivery films, etc.
Advantages:
1. Versatility: applicable to a variety of materials, including refractory materials and complex compounds.
2. High-precision control: ability to precisely control film thickness and composition.
3. Fast deposition: ability to achieve fast film growth, suitable for efficient production.
4. High material transfer efficiency: high material utilization, reduced waste.
Disadvantages:
1. High equipment cost: high cost of lasers and vacuum systems.
2. Complex process parameters: need to precisely control parameters such as laser energy, pulse frequency and substrate temperature.
3. Film uniformity: it is challenging to deposit uniform films on large substrates.
4. Target material consumption: target material consumption is fast and needs to be replaced frequently.
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
