Etching

1 Deep silicon etching (DRIE)

Maximum aspect ratio 50:1

Sample size: small piece, 4 inches, 6 inches, 8 inches

2 Reactive ion etching (RIE)

Etching materials: Si, SiN, SiO2

Sample size: small piece, 4 inches, 6 inches, 8 inches

3 Ion beam etching (IBE)

Etching materials: Au, Ti, Cr, Ni, VO2, Al2O3, W, Al, and other metals, oxides, nitrides

Sample size: small piece, 4 inches, 6 inches, 8 inches

4 Silicon oxide, SiC etching

Etching materials: quartz, glass, SiC, etc.

Sample size: small piece, 4 inches, 6 inches

5 Metal dry etcher

Etching of metals and metal compounds such as Ti, TiN, Al, Al2O3, Ta, TaN, Mo, Ge

Sample size: small piece, 4 inches, 6 inches

6 ICP etching

Etching materials: GAN, GaAs, AlGaInP, etc.

7 Wet etching

Acidic: H2SO4, HF, BOE, Cr etching solution

Alkaline: KOH, TMAH

8. Deep silicon etching