Principle:
Anodic Bonding, also known as electrochemical bonding, is a technology used to tightly bond materials such as glass and silicon together. It is widely used in the manufacture of microelectronics and microelectromechanical systems (MEMS). Its principle is based on the bonding between materials through electrochemical reactions under high temperature and electric field.
Processing Capability:
6&8 inch Silicon - Glass Anodic Bonding
Process Flow:
1. Material Preparation: Select suitable glass and silicon materials. Glass containing sodium ions (such as soda-lime glass) is usually used because the presence of sodium ions is the key to achieving anodic bonding.
2. Heating: Heat the glass and silicon materials to a certain temperature (usually between 300°C and 450°C) so that the atoms of the materials have enough kinetic energy for bonding
3. Apply an electric field: During the heating process, a high voltage (usually hundreds to thousands of volts) is applied between the glass and silicon through electrodes. One side of the glass is connected to the anode and the other side of the silicon is connected to the cathode.
4. Ion migration: Under the action of the electric field, the sodium ions in the glass migrate toward the cathode (i.e. silicon), resulting in the formation of a sodium ion defect area on the glass surface, thereby increasing the electric field strength at the interface between the glass and silicon.
5. Bonding: Due to the migration of sodium ions and the action of the electric field, a strong chemical bond is formed between the glass and the silicon surface, ultimately achieving a tight bond between the materials.
Advantages:
High-strength bonding: The bonding interface has high strength and can withstand greater mechanical stress.
Good airtightness: The interface after bonding has good airtightness and is suitable for manufacturing devices that require sealing.
High precision: Suitable for the manufacture of devices with micron-level precision.
Application areas:
Microelectromechanical systems (MEMS): such as sensors, micropumps, microvalves, etc.
Packaging technology: such as packaging of microelectronic devices.
Optical devices: such as optical sensors and filters.
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
