Bonding

Hi, I am glad to meet you on this page. By reading this page, you will see our diverse bonding capabilities, and we will also bring you some surprises.

As we are accustomed to the bonding, the most commonly used bonding methods are eutectic bonding, anodic bonding, wire bonding, temporary bonding, etc., but these bonding methods can only bond limited materials and have many limitations.

Surface activated bonding can achieve X-O-X bonding, breaking through the limitations of materials, and can achieve bonding at room temperature, making the application of bonding more extensive.

Shanghai Omeda has been committed to the development of bonding technology and project execution for a long time, and has accumulated rich experience. Our bonding experience can provide more guidance for your needs.

Anodic bonding: silicon-glass bonding, silicon-silicon bonding

Temporary bonding: adhesive bonding, debonding

Eutectoid bonding: Au-Au bonding, Au-Sn bonding, Au-Si bonding

Wire bonding: Au wire

Fusion bonding: Quartz glass bonding, sapphire bonding

Surface activated bonding**:

Glass-glass bonding, silicon-silicon bonding, diamond-gallium nitride bonding, silicon carbide-silicon carbide bonding, lithium niobate crystal-silicon carbide bonding, silicon carbide-silicon bonding, lithium tantalate crystal-silicon carbide bonding, diamond-indium phosphide bonding

Gallium arsenide-silicon carbide bonding, diamond-silicon carbide bonding, germanium-germanium bonding, sapphire-sapphire bonding, glass-silicon nitride bonding, gallium arsenide-silicon carbide bonding, indium phosphide-silicon carbide bonding

More materials------