Processing capabilities:
Material:
SiO2 (silicon oxide),
Si3N4 (silicon nitride)
Application:Low Stress Silicon Nitride and Low Loss Si3N4 (Silicon Nitride)
Poly Si (polycrystalline silicon),
Wafer Size: 6 inch
Wafer Thickness: 500 -750um
DepoSition thickness :0-1.3um
Processed Wafer Types: Silicon Wafer
TEOS SiO2 (tetraethoxysilane)
Size: 2-12 inches
Equipment capacity: 25 pieces per furnace, 50 pieces per furnace
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
