LTOI Wafer

Application:

SAW surface acoustic wave device--POI wafer

TFLT PIC thin film lithium tantalate photonic integrated circuit

Size: 4 inches 6 inches 8 inches

Processing technology: hydrophilic bonding + high temperature annealing, surface activation bonding (room temperature bonding, no annealing required)

Customized processing: In addition to standard LNOI and LTOI wafers, we also provide customized processing services for LNOI and LTOI wafers.

Our advantages: full process and comprehensive processing capabilities

*Ion implantation

*Thinning and polishing

*Surface activation bonding

*Hydrophilic bonding

*Annealing

Comprehensive processing capabilities can provide you with fast and efficient customized processing services.