Wafer and Chip Cutting

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OMedaSemi provides cutting  services. We provide two methods: wheel cutting and laser cutting. Both methods can be used for cutting chips and wafers

Wheel cutting;

*Chip and wafer cutting

*Cutting precautions; cutting path should be reserved; 300um

*Only squares can be cut

*Low cutting efficiency

Laser cutting (ordinary laser cutting and Stealth Dicing);

*Chip and wafer cutting

*Cutting path should be reserved; 100um

*Any two-dimensional plane shape can be cut,for example 8inch SOI cutted to 4inch and Chamfering

*High cutting efficiency

Processable materials;

    Conventional materials; Si, Glass, Sapphire

    Compound semiconductors; InP, GaAs

    Crystals; LiTaO3/LiNbO3

    Advanced substrates; SiC, GaN, Diamond

    Thin film; Si3N4/SiO2

    Size: 4 inches, 6 inches, 8 inches ,12 inches

Processing case:

LNOI/LTOI wafer cutting

Au coated Wafer Cutting

Grating wafer cutting

8inch SOI cutted to 4inch and Chamfering