SAB6310 Full-Auto Thermal Compression Bonder For Mass Production
If you are interested in this machine ,please send email to us and we will organize a online meeting(Teams Zoom Google Meeting) to show more data about this machine .
| Wafer size | 8inch 12inch |
Bondable materials | Si, Cu, Au, Au-Sn, Al-Ge, etc |
Maximum temp | 600℃ |
Maximum pressure | 100kN，accuracy ≤±1% |
Heating rate | 30℃/min |
Temp. uniformity | ≤±1.5% |
Anodic voltage/current | ≤2kV，≤100mA |
Post-bonding accuracy | ≤5μm，≤2μm |
Wafer load | Cassette |
Multi-module integrated | Pre-align, activation, clean, align, bond |
| Bonding atmosphere | Vaccum, Formic acid, Inert gas(optional) |
Semi-Auto Thermal Compression Bonder SAB6300 For Research
| Wafer Size | 2-8inch |
Bondable materials | Si, Cu, Au, Au-Sn, Al-Ge, etc. |
Maximum temp. | 600℃ |
Maximum pressure | 100kN，accuracy ≤±1% |
Heating rate | 30℃/min |
Temp. uniformity | ≤1.5% |
Anodic voltage/current | ≤2kV，≤100mA |
Post-bonding accuracy | ≤5μm，≤2μm |
Bonding atmosphere | Vaccum, Formic acid, Inert gas(optional) |
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
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