LNOI Wafer

Application:

SAW surface acoustic wave device--POI wafer

TFLN PIC thin film lithium niobate photonic integrated circuit

Size: 4 inches 6 inches 8 inches

Crystal Orientation: X cut (for TFLN PIC), Y cut-Y128, Y36 (SAW), Z cut (SAW)

Processing technology: hydrophilic bonding + annealing, surface activation bonding

Customized processing: In addition to standard LNOI wafers, we also provide customized processing services for LNOI wafers.

Our advantages: full process and comprehensive processing capabilities

*Ion implantation

*Thinning and polishing

*Surface activation bonding

*Hydrophilic bonding

*Annealing

Comprehensive processing capabilities can provide you with fast and efficient customized processing services.