Application:
SAW surface acoustic wave device--POI wafer
TFLN PIC thin film lithium niobate photonic integrated circuit
Size: 4 inches 6 inches 8 inches
Crystal Orientation: X cut (for TFLN PIC), Y cut-Y128, Y36 (SAW), Z cut (SAW)
Processing technology: hydrophilic bonding + annealing, surface activation bonding
Customized processing: In addition to standard LNOI wafers, we also provide customized processing services for LNOI wafers.
Our advantages: full process and comprehensive processing capabilities
*Ion implantation
*Thinning and polishing
*Surface activation bonding
*Hydrophilic bonding
*Annealing
Comprehensive processing capabilities can provide you with fast and efficient customized processing services.
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
+86 188 233 40140
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+86 188 233 40140