SAB6210-HB Full Auto Hybrid Bonder
If you are interested in this machine ,please send email to us and we will organize a online meeting(Teams Zoom Google Meeting) to show more data about this machine .
Main Specifications
- Compatible with 8/12 inch wafer
- Bonding accuracy: ±0.5μm; ±0.2μm; ±0.1μm
- Bonding strength: ≥2.5J/㎡ (SiO2/Cu)
- Throuphput: 12 bond/h
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
+86 188 233 40140
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Inquiry, cooperation consultation email
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+86 188 233 40140
