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SAB6400 Semi-automatic temporary bonding and debonding machine

SAB6400--Semi-automatic temporary bonding and debonding machine

If you are interested in this machine ,please send email to us and we will organize a online meeting(Teams Zoom Google Meeting) to show more data about this machine .

Glue Curing machine

Wafer size4-8 inch

Integrated modules

Gluing (glue supply, edge removal, back washing) Curing

Applicable Materials

Open platform, suitable for all kinds of temporary bonding materials




Temporary heat compression bonding machine


Wafer size4-8 inch

max pressure

50kN

Maximum temperat ure

550℃


Debonding machine

Wafer size4-8 inch

Integrated modules

Thermal sliding (heating, sliding) Laser debonding (optional) Cleaning (chemical solution, drying)

Hot plate temperature

≤250℃ active temperature control



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About Us

OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.

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