Home
About us
Company info
Shipping&Payment
NanoFabrication
Photo lithography
Laser direct writing lithography
Electron Beam Lithography Service
6/8 inch 150nm DUV Stepper
Contact lithography
Etching
RIE
IBE
ICP Etching
DRIE
FIB
Coating
E-Beam Evaporation
Magnetron Sputtering
Ion-Beam Sputtering
Atomic layer Deposition
Pulsed Laser Deposition
Optical Coating
LPCVD
PECVD
Bonding
Anodic bonding
Temporary Bonding and Debonding
Wire Bonding
Eutectic bonding
Surface Actived Bonding
Fusion Bonding
Hydrophilic Bonding
Wafer and Chip Cutting
Gringding&CMP
Ion Beam Implantation
Furnace annealing and rapid annealing
Nanoimprint printing
**Two photon Polymerization 3D printing Service
Wafer Series
Normal Wafer
Large Warpage Wafer
Silicon Wafer
Glass Wafer
Theraml Oxide SIlicon Wafer
Ultra Thin Wafer
Patterned Wafer
Composite Wafer
4-12inch SOI Wafer
Low Loss SINOI Wafer
8 inch LTOI Wafer
8inch LNOI Wafer
6inch 4H HPSI SICOI Wafer
8inch PZT Film Wafer
POI (Piezoelectric on Insulator)Wafer
X on X Composite substrate**
Advanced Wafer
Sapphire Wafer
12inch N Type & 4H Semi Insulating SiC Wafer
Gallium Nitride and GaN Epitaxial Wafer
Ga2O3 Wafer
Diamond Wafer
III-V Wafer
GaAs Wafer
InP wafer
Advanced Crystal Wafer
Lithium Niobate Crystal
Lithium Tantalate Crystal
Advanced Material
7N Single Crystal Copper
EPI Wafer
Silicon Carbide EPI
Device Fabrication
Nano-Optics
**Diffractive Grating
**Metalens Fabrication
PIC
Lithium Niobate Waveguide
Silicon nitride optical waveguide
Silicon Photonics Waveguide
Other Device
**Photonics Wire Bonding
Two photon Polymerization Lithography Resist Glue
Deep silicon etching
Forked electrode
Mask template processing
Customized CGH
SAW/BAW AcousticDevice
Flexible electrode
Machine and Device
Bonding Machine
SAB6310 Full-Auto Thermal Compression Bonder
SAB6400 Semi-automatic temporary bonding and debonding machine
SAB6210-HB Full Auto Hybrid Bonder
SAB8300 Semi Auto Chip to Chip Bonding Machine
SAB8210CW--Fully automatic Chip to Wafer chip bonding machine
Atomic Layer Deposition Machine
Atomic Layer Deposition Machine
Ion Beam Trimming Machine
Gas Cluster Ion Beam(GCIB) Trimming Machine SAB9510
Wafer Grinding Machine
Wafer Grinding Machine WG200
Product
PPLN Laser Frequency Converter
Wafer Cleaner
Film stress tester
PPLN Laser Frequency Converter
News
Contact us
中文
/
ENGLISH
You are here:
Home
>
Contact
Contact Details
Email
jing.chen@omeda-optics.com
Whatsapp / Phone
+86 188 233 40140
Please contact me
Name
*
E-mail
*
Company name
Whatsapp / Phone
What can we contact you about
*
Submit
Copyright 2024 omeda Inc. All Rights Reserved.
TOP