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Laser direct writing lithography

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6/8 inch DUV Stepper lithography

Contact lithography

Etching

RIE

IBE

XXXX

ICP Etching

DRIE

FIB

Coating

E-Beam Evaporation

Magnetron Sputtering

Ion-Beam Sputtering

Atomic layer Deposition

Pulsed Laser Deposition

Optical Coating

LPCVD

PECVD

Bonding

Anodic bonding

Temporary Bonding and Debonding

Wire Bonding

Eutectic bonding

Surface Actived Bonding

Fusion Bonding

Hydrophilic Bonding

cutting

Gringding&CMP

ion implantation

Furnace annealing and rapid annealing

Nanoimprint printing

**Two photon Polymerization 3D printing Service
Innovative Products and Service

**Photonics Wire Bonding

**Grating and Metasurface

Flexible electrode

Silicon optical waveguide

Silicon nitride optical waveguide

Lithium niobate waveguide processing

Microfluidic chip

Suspended beam chip

Mask template processing

Forked electrode

Deep silicon etching

Two photon Polymerization Lithography Resist Glue
Wafer Series

GaAs Wafer

InP wafer

Glass Wafer &High Refraction Index Wafer

Silicon Wafer wafer&Thermally oxidized Si wafer

Wafer with Diverse Material Coating

N Type & 4H Semi Insulating SiC Wafer

Gallium Nitride and GaN Epitaxial Wafer

Ga2O3 Wafer

Diamond Wafer

Customized SOI Wafer

InPOI Wafer

Ultra low loss Si3N4 ThinFilm wafer(SINOI)

POI (Piezoelectric on Insulator)Wafer

LTOI Wafer

LNOI Wafer

4H HPSI SICOI Wafer

X on X Composite substrate**
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+86 188 233 40140

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jing.chen@omeda-optics.com

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+86 188 233 40140

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