Principle:
Fusion Bonding, also known as direct bonding, is a technology used to directly bond two pieces of the same or different materials (usually silicon, glass, etc.) together at high temperatures. This technology is widely used in semiconductor manufacturing and micro-electromechanical systems (MEMS) manufacturing.
Processing Capabilities:
Applications:
Featured Processes - Quartz Glass Quartz Glass Fusion Bonding
Featured Processes - Sapphire Sapphire Fusion Bonding
Process Flow:
1. Surface Preparation:
Cleaning: Thoroughly clean the surfaces of the two materials to be bonded to remove any impurities that may affect the quality of the bond.
Flattening: Ensure that the surfaces of the two materials are very flat and smooth, usually achieved through polishing and chemical mechanical flattening (CMP) processes.
2. Initial Contact:
Alignment and Contact: Align and gently contact the two materials at room temperature so that they form initial adhesion through van der Waals forces or hydrogen bonding forces.
3. Heating and pressurizing:
Heating: The preliminarily adhered materials are gradually heated to a high temperature (usually between 800°C and 1100°C) so that the atoms on the surface of the materials can obtain sufficient kinetic energy for diffusion.
Pressurizing (optional): In some cases, appropriate pressure can be applied while heating to enhance the bonding effect.
4. Atomic diffusion and bonding:
At high temperatures, the diffusion of atoms on the surface of the materials allows the atoms of the two materials to bond to each other and form a strong chemical bond.
Advantages:
High-strength bonding: Since it is chemically bonded between atoms, the molten bonding interface has high mechanical strength.
Excellent thermal stability: The bonded interface can remain stable at high temperatures.
High-purity interface: Since no intermediate layer is required, the bonding interface is very pure and suitable for devices with high purity requirements.
Applications:
- Semiconductor manufacturing: such as bonding of silicon wafers, used to manufacture SOI (Silicon On Insulator) wafers.
- Microelectromechanical systems (MEMS): such as the manufacture of devices such as pressure sensors and accelerometers.
- Optical devices: such as the manufacture of optical waveguides and filters.
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
