8inch LNOI Wafer

OMedaSemi can provide 4-inch and 8-inch LNOI wafers and LN-SOI

We provide 4-8 inch LNOI wafers (thin-film lithium niobate), which use surface activated bonding or Hydropholic bonding(Directly Bonding) technology to bond thermal oxide wafers and Lithium niobate crystal(Xcut and Zcut)(Congrudent LN ,Stochoimetric LN,MgO:Doped LN) wafers together, and then control the thickness to the thickness you need through ion implantation, annealing, thinning(Thin Fiim LN<600nm) or direct thinning and CMP polishing(Thick Fiim LN >600nm) . It is worth noting that ion implantation and direct CMP and thinning have their own advantages and disadvantages. We provide customers with a variety of LNOI products.

Also we have 6inch LTOI(lithium tantalate) wafer and PZTOI Wafer (A Novel Electro-Optical Platform).

Our Innovation(For Ultra Uniform LN Layer ):

Compared with general LNOI wafer ,we add a innovative process:"Gas Cluster Ion Beam Trimming process " to improve the uniformity(Thickness uniformity Range<57A) of LN thickness and get lower roughness .

Compared with RIE or IBE Trimming Machine:(Please click to know more about the " Gas Cluster Ion Beam Trimming Process")

GCIB Trimming have smaller beam size(GCIB:4-5mm,others:10mm) ,and can cntrol smaller area 'uniformity

GCIB Trimming cause less damage to crystal and release less heat in chamber to get the best crystal quality.

6 inch LTOI Wafer Without Trimming Service: Range 100A-200A

6 inch LTOI Wafer With Trimming Process:Range:<57A

Lithium tantalate thin films are divided into thick films (greater than 600nm) and thin films (300nm-600nm)

Thin film lithium tantalate(300nm-600nm)

Using hydrophilic bonding or surface activation bonding technology, the lithium tantalate crystal is first ion implanted, and then the thermal oxide sheet and the X-cut or Z-cut lithium tantalate crystal wafer are bonded together. The defects of ion implantation are enlarged by annealing, and the lithium tantalate substrate is peeled off, leaving the lithium tantalate thin film. The surface is CMP polished and ion beam refined to obtain the finished product, and the thickness is controlled to the thickness you need.

Thick film lithium tantalate(>600nm for quantum application )

Using hydrophilic bonding or surface activated bonding technology, the lithium tantalate crystal and the thermal oxide sheet are directly bonded together, and then the lithium tantalate crystal is directly thinned by thinning and polishing to a thickness of about 10um, and then CMP processing is performed. After polishing to an approximate thickness, ion beam finishing is performed to fine-tune the film thickness accuracy of the surface. The resulting wafer can maintain a film thickness uniformity of +-100nm on a 6-inch wafer.

It is worth noting that ion implantation and direct CMP and thinning have their own advantages and disadvantages. We provide customers with a variety of LNOI products.

Application:

SAW surface acoustic wave device--POI wafer

TFLN PIC thin film lithium niobate photonic integrated circuit--LNOI wafer

Size: 4 inches 6 inches 8 inches

Crystal Orientation: X cut (for TFLN PIC), Y cut-Y128, Y36 (SAW), Z cut (SAW and Quantum),LN-SOI

Crystal Type:Congrudent LN,Stoichoimetric LN,MgO Doped LN

Processing technology: hydrophilic bonding+Smartcut + annealing, surface activation bonding

Customized processing: In addition to standard LNOI wafers, we also provide customized processing services for LNOI wafers.

Data support :

Refractive index and Absorption of Bulk crystal and Thin Film Crystal.zip