Wafer Grinding Machine WG200

Wafer Grinding Machine 

High-Precision Grinding

The entire machine is equipped with a spindle axis  that has high rigidity, low vibration, and minimal  rotational speed fluctuation to achieve high precision  and quality processing. For the chuck table axis, an  air bearing unit has been installed, which is  characterized by high rigidity, low vibration, low  thermal expansion, and minimal  rotational speed fluctuation.

Available for various wafer 

The entire machine is equipped with 2 spindle(6.3kw)  axis 3 chuck tables and one turn table. This machine supports various workpieces up to Φ8  inches, including difficult-to-process materials such as  Silicon, LT, LN, and SiC.

Usability 

The user interface equipped 21 inch display panel. User can monitor the machine`s statue and wafer  process data in real time at main screen. The software supports a remote interface, allowing  users to remotely monitor equipment and operate the  software through the Net. 

Improved space productivity

 The machine's footprint is significantly smaller than  that of its industry peers, saving space.