Principle:
Temporary Bonding is a technology used to temporarily fix and support wafers during semiconductor manufacturing and microelectromechanical systems (MEMS) manufacturing. This technology is particularly suitable for intermediate steps in multi-step processing. When the wafer needs to be thinned, processed or handled, temporary bonding provides the necessary support and stability. Temporary bonding can be easily removed after manufacturing is completed for subsequent processing or final device assembly.
Processing Capabilities:
Temporary Bonding
Laser Debonding
UV Debonding
Size: 4-12 inches and small pieces
Process Flow:
1. Material Selection:
Handle Wafer: Usually a solid wafer used to support the thinned wafer.
Temporary Bonding Material: Select a suitable temporary adhesive, such as thermoplastic material, ultraviolet (UV) curing material or strippable adhesive.
2. Initial Preparation:
Surface Treatment: Ensure that the surface of the wafer to be bonded and the handle wafer are clean and free of impurities.
Apply temporary bonding material: Apply temporary adhesive evenly on the base wafer.
3. Alignment and contact:
Alignment: Align the wafer to be bonded with the base wafer.
Contact: Lightly contact the two to form a preliminary adhesion.
4. Curing and bonding:
Curing: According to the characteristics of the temporary bonding material, the adhesive is cured by heating, UV irradiation or other methods to achieve a stable temporary bond.
5. Processing:
Wafer processing: After the temporary bonding is completed, various processing steps such as etching, deposition, etching, etc. are performed on the thinned wafer.
6. Removal of temporary bonding:
Separation: After all necessary processing steps are completed, the temporary bonding material is removed by heating, solvent dissolution or other methods.
Cleaning: Clean the wafer surface and remove residual adhesive.
Advantages:
Support thin wafer processing: Temporary bonding provides support so that ultra-thin wafers will not break or bend during processing.
Processing flexibility: After completing certain key processing steps, temporary bonding can be removed again for subsequent processing.
High precision: It can ensure alignment accuracy during multi-step processing.
Application areas:
Semiconductor manufacturing: such as the manufacturing of SOI (Silicon On Insulator) wafers and the stacking of three-dimensional integrated circuits (3D ICs).
Microelectromechanical systems (MEMS): For example, temporary fixing of wafers is required during the manufacturing process of sensors and actuators.
Advanced packaging technology: such as wafer-level packaging (WLP), temporary bonding is used to handle thinned wafers during the packaging process.
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
