SAB6110CST--Fully automatic high-capacity room temperature bonding machine
Application：
*Composite substrate manufacturing： SOl, POl, etc.;
*Three-dimensional stacking for CIS, word storage chips, chiplet manufacturing;
*MEMS, fluidic devices, microLED and other advanced manufacturing.
| Wafer size | 2-12 inch |
Adaptive materials | Si, LT/LN, sapphire, InP, SiC, GaAs, GaN and other semiconductor materials as well as metals, glass, etc. |
Capacity | ≥10 pair/h |
Loading mode | Cassette |
Maximum pressure of pressurized system | 100 kN |
Alignment method and accuracy | Edge alignment accuracy ≤±50μm Mark alignment ≤±2μm |
Bond strength | ≥1.5J/m² @Room temperature (Si- Si direct bonding) |
layout | Multi-cavity cluster layout |
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
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