SAB6210--Fully automatic Hydrophilic Wafer bonding machine
| Wafer size | 2-12 inch |
Adaptive materials | SOI、POI、Hybrid Bonding |
Capacity | ≥14 pair/h |
Loading mode | Cassette |
Alignment accuracy | ≤ ±50μm/±0.2μm/±100nm（ Optional） |
Bond strength | ≥2.0J/m² (Si-SiAfter bonding annealing) |
Multi-module integrated | Edge finding, plasma activation, cleaning, alignment, bonding, inspection |
Liquid cleaning | Optional |
other | FFU controls the cleanliness inside the machine |
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
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