SAB8300CW--Semi-automatic C2W chip bonder
| Pressure range/pressure control stability | 1~50N：±0.5N 51~2000N：±2N |
Post-bonding accuracy | ≤±2μm；≤±1μm；≤±500nm |
Activation method | Formic acid catalytic activation, ion activation (optional) |
Bonding chamber atmosphere | Low vacuum, inert atmosphere |
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
+86 188 233 40140
9:00-18:00 Sales Service Hotline
Inquiry, cooperation consultation email
Whatsapp / Phone
+86 188 233 40140
