SAB6400--Semi-automatic temporary bonding and debonding machine
Glue curing machine
| Wafer size | 4-8 inch |
Integrated modules | Gluing (glue supply, edge removal, back washing) Curing |
Applicable Materials | Open platform, suitable for all kinds of temporary bonding materials |
Temporary heat compression bonding machine
| Wafer size | 4-8 inch |
max pressure | 50kN |
Maximum temperat ure | 550℃ |
Debonding machine
| Wafer size | 4-8 inch |
Integrated modules | Thermal sliding (heating, sliding) Laser debonding (optional) Cleaning (chemical solution, drying) |
Hot plate temperature | ≤250℃ active temperature control |
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
+86 188 233 40140
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+86 188 233 40140
