SAB6410--Fully automatic temporary bonding machine
| Wafer size | 2-12 inch |
Maximum temperature | 500℃ |
Maximum pressing force | 100kN, control accuracy ≤±1% |
Heating rate | 30℃/min |
Temperature uniformity | ≤±2% |
Alignment accuracy | ≤100μm |
TTV after bonding | ≤3μm |
Multi-module integrated | Edge finding, spin coating, baking, pre- bonding, bonding |
Debonding method | Thermal slip, laser debonding |
other | FFU controls the cleanliness inside the machine |
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
+86 188 233 40140
9:00-18:00 Sales Service Hotline
Inquiry, cooperation consultation email
Whatsapp / Phone
+86 188 233 40140
