SAB6300--Semi-automatic hot-press anode wafer bonding machine
| Wafer size | 2-12 inch |
Adaptive materials | Si, Cu, Au, Au-Sn, Al-Ge.,etc |
Maximum temperature | 600℃ |
Maximum pressing force | 100kN, control accuracy ≤±1% |
Heating rate | 30℃/min |
Temperature uniformity | ≤±2% |
Anode voltage and current | ≤2kV，≤100mA |
Post-bonding accuracy | ≤5μm，≤2μm |
Bonding atmosphere | Vacuum, formic acid, inert atmosphere (optional) |
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
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