Silicon Wafer

OMedaSemi provides silicon wafers. From 4inch to 12inch ,we have rich stock in 6inch 8inch and 12inch 

1. First, we introduce our featured products below, including

    #Ultra-flat silicon wafer TTV<500nm

    #High-resistance silicon wafer resistivity>10000ohm*cm

    #Ultra-thin silicon wafer 8-inch thinnest 8um 12-inch thinnest 15um, and we can also undertake post-processing services such as thermal       oxidation, coating, exposure, development, and etching

2. We usually use some common silicon wafer specifications when doing projects. We will display them below for you to choose. These silicon wafers can meet most needs and are all high-quality silicon wafers

**6-inch**

*6-inch low-resistivity silicon wafer 47.5 flat edge (57.5 flat edge optional) P100

6-inch low-resistivity silicon wafer 47.5 flat edge (57.5 flat edge optional) P100.pdf

*6inch  High-resistivity(>10000ohm*cm) 47.5 flat edge (57.5 flat edge optional) P100

6inch  High-resistivity(10000ohmcm) 47.5 flat edge (57.5 flat edge optional) P100.xlsx

**8-inch**

*8-inch low-resistivity silicon wafer notch P100

8-inch low-resistivity silicon wafer notch P100.pdf

*8inch  High-resistivity(>10000ohm*cm) notch P100

8inch  High-resistivity(10000ohmcm) notch P100.pdf

*8-inch heavily doped 0.002-0.004 ohm*cm, notch, N111 CZ

8-inch heavily doped 0.002-0.004 ohmcm, notch, N111 CZ.xlsx

Featured products:

#High-quality silicon wafers TTV<5um BOW WRAP<20um Ra<0.5nm

Can be directly used for 6-inch and 8-inch DUV stepper lithography machines to meet the stringent requirements for wafers

Can be directly used for various bonding requirements for wafers

#Provide ultra-flat silicon wafers comparable to Finland's OKemetics, and can mass-productation ultra-flat silicon wafers with TTV<500nm. The measured data are as follows

#Provide >10000ohm*cm FZ high-resistance silicon wafers for acoustic and electro-optic modulation applications

Can provide thermal oxidation high-resistance wafers with thermal oxidation and PolySi (Trap Rich Layer)

#Provide ultra-thin silicon wafers 8-inch thinnest 8um 12-inch thinnest 15um, using temporary bonding + debonding + thinning and polishing process to obtain ultra-thin silicon wafers