POI (Piezoelectric on Insulator)Wafer

OMedaSemi provide poi(Piezoelectric on Insulator) wafer,we have both hydrophilic bonding and Surface Active Bonding . Not only LNOI and LTOI wafer , we also can provide LN/LT-SIC,LN/LT-Quartz,LN-SiO2-Sic

Application:SAW surface acoustic wave device--POI wafer

Type:

*LNOI

*LTOI

*LN/LT-SIC

*LN/LT-Quartz

Size: 4 inches 6 inches 8 inches

Crystal Orientation:  Y cut-Y128, Y36 (SAW), Z cut (SAW) and more

Processing technology: hydrophilic bonding + annealing, surface activation bonding

Customized processing: In addition to standard LNOI wafers, we also provide customized processing services for LNOI wafers.

Our advantages: full process and comprehensive processing capabilities

*Ion implantation

*Thinning and polishing

*Surface activation bonding

*Hydrophilic bonding

*Annealing

*Grinding+CMP

Comprehensive processing capabilities can provide you with fast and efficient customized processing services.

Related Paper:

LiNbO₃/SiO₂/SiC POI Wafer---THEORECTICAL OPTIMAZATION OF SURFACE ACOUSTIC WAVES RESONATOR BASED ON 37Y-47 LINBO3/SIO2/SIC MULTILAYERED STRUCTURE

Cu/LiNbO3/SiO2/SiC POI Wafer +SAW --Ultra-Wideband Surface Acoustic Wave Filters Based on the Cu/LiNbO3/SiO2/SiC Structure

Linbo3+SIC POI Wafer +SAW --Analysis of Plate Acoustic Waves Resonance Properties Using Thin Plate of LiNbO3 SiC

LiNbO₃/SiO₂/SiC POI Wafer + SAW --Near 6-GHz Longitudinal Leaky SAW Filters with Spurious Mitigation on LiNbO₃/SiO₂/SiC Platform

Enlarging Rayleigh Elimination Window through Modulating Substrate and LiNbO₃ Cut Angle for Fabricating LNOI-Based Spurious-Free Wideband SAW Filters

LINbO3+Quartz POI Wafer +SAW--LiNbO3 Plate Bonded to Quartz as a Substrate for High Frequency Wideband SAW Devices

Evolution of SAW and BAW Devices Using Thin LiTaO3 and LiNbO3

LiNbO3+Quartz POI Wafer +SAW--Hetero Acoustic Layer Surface Acoustic Wave Resonator Composed of LiNbO3 and Quartz

Acoustic Devices PAW SAW and BAW using Wafer Bonding Technology