SAB6100--Semi-automatic room temperature bonding machine
SPECIFICATION
| Wafer Size | ≤12 inches, backward compatible with irregular shaped samples |
Adaptive materials | Si, LT/LN, sapphire, InP, SiC, GaAs, GaN, diamond, glass, etc. |
Loading mode | Manual loading |
Maximum pressure of pressurized system | 80 kN |
Surface treatment | In-situ activation and sputtering deposition |
Sputtering Target | ≥3, rotatable |
Bond strength | ≥1.5J/m²@room temperature (Si-Si, glass-glass bonding) |
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
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