OMedaSemi offers RDL redistribution processing on 12-inch wafers. We also have ready-made redistribution wafers available for semiconductor equipment manufacturers to use for equipment testing and calibration.
Our processing capabilities are as follows:
Capbility:
- RDL Layers: 3P3M (Fan-in) / 5P5M (Fan-out)
- Min. L/S: 2/2 µm (Fan-in) / 5/5 µm (Fan-out)
Application：CPO HBM Logic
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
