OMedaSemi offers 12-inch BUMP wafer processing, and we also have standard BUMP wafers available for sale for equipment manufacturers to use for equipment calibration and validation.
Bump Type：Solder Bump/Pillar Bump
Bump Structure：CuNiSnAg、CuSnAg、 NiAu
Min. Bump Size：12um
Min. Bump Pitch：22um
Min. Solder Ball Size：150um
Min. Solder Ball Pitch：250um
OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.
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