"Large warpage wafer - Crying face and smiling face - 12-inch BOW 500um for equipment verification"

Shanghai Aomeda Microelectronics, based on its self-developed processes, has successfully developed high-warped silicon wafer products.

Currently, we can provide 12-inch wafers with a BOW value of up to 500um, and we are also in the process of developing wafers with even higher warpage (800um, 1000um) to meet the market's diverse demand for warped wafers.

Regarding BOW value accuracy, we can achieve a precision of 5%, and the BOW value can be precisely controlled.

We have accumulated a large amount of data, and if you are interested, please contact us for more information.

Additionally, we also offer an ultra-thin wafer series, with 12-inch silicon wafers thinned and polished down to a minimum thickness of 15um.