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4 inch thick film soi by bonding grinding CMP for MEMS and others

Date: 2026-02-27 10:25:35     Hits: 15

website: en.omedasemi.com

Phone :+86 18823340140

Email:jing.chen@omeda-optics.com

Recently ,we start a new production line of 4inch thick film soi wafer ,it is thick film line based bonding ,edge trimming ,grinding and cmp process.

For 4inch foundry and univeristy fab ,most cleaning room is also 4inch equipment , but most SOi foundry have transfer to 6inch 8inch 12inch and even bigger .

So our 4inch thick film soi wafer is a good news for univeristy fab , 4inch foundry .

we have fabricate some pieces in past 1months . and i share the data as following

our advantage is :

lead time :3-4 weeks

Moq:5Pcs if we have thermal oxide wafer stock

Test report we have done recently

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50um sOI wafer

(1). SAM Inspection for Internal Voids at Bonding Interface of 3pcs SOI Wafers

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(2). Device Layer & Box Layer Thickness of 3pcs SOI Wafers

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(3).  Total Thickness, Surface Particle Count & BOW of 3pcs SOI Wafers

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About Us

OMeda (Shanghai Omedasemi Co.,Ltd) was founded in 2021 by 3 doctors with more than 10 years of experience in nanpfabrication. It currently has 15 employees and has rich experience in nanofabrication (coating, lithography, etching, two-photon printing, bonding) and other processes. We support nanofabrication of 4/6/8-inch wafers.

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